Semi-automatic Wafer Taping Pasting Equipment
Mainly used in 8 inch, 12 inch wafer products
Features

X,Y,R axis manipulator, accurate positioning, repeated accuracy ±0.05.

Can rotate 360 degrees custom equal length attach tape.

Customizable adhesive length.

Tape out of material alarm.

The tray can be quickly replaced and positioned.

Internal material detection, inconsistent with the set procedure alarm.

Specification
Operating System PLC&WIN Control
Operation Interface Human-machine Screen&HIMI
Control Mode Bus Control
Movement Precision ±0.1 mm
UPH 12S/PCS(4 equal parts)
Transmission Speed
Positioning Accuracy ±0.05mm
Transport Height
External Dimension 800*800*850mm
Weight 80KG
Input Power AC 220V
Air Pressure 0.4-0.8MPa